AAEON introduces new UP Squared development boards

AEON's UP brand has today launched two new development boards based on the latest Intel® Core™ 3 processor platform (formerly known as Twin Lake): UP Squared TWL and UP Squared Pro TWL. Both boards offer a choice of Intel® Core™ 3 Processor N355, Intel® Processor N250 or Intel® Processor N150 - the latest processors from Intel with a focus on low power consumption and energy efficient performance.

Measuring just 85.6 mm × 90 mm, the UP Squared TWL is the more compact of the two models. AAEON positions it as an entry-level model for the development of industrial applications. The board is equipped with two RS-232/422/485 pin wafers, three USB ports and a 40-pin HAT with GPIO, SPI, I2C, I2S and UART functionality.

The UP Squared TWL comes with up to 16 GB of soldered LPDDR5 RAM and 128 GB of eMMC storage, but also offers an M.2 2280 M-Key slot for further storage expansion and an M.2 2230 E-Key for Wi-Fi module installation.

The UP Squared Pro TWL is the larger model with dimensions of 101.6 mm × 101.6 mm and offers more advanced I/O, ideal for low-power inferencing and machine vision applications. It also comes with 16 GB LPDDR5 RAM, but has 64 GB eMMC storage. In turn, it supports both M.2 2280 M-Key and SATA SSD, providing greater flexibility in storage options.

In addition, the UP Squared Pro TWL includes an M.2 3052 B-Key with Nano SIM slot for 5G/LTE connectivity and a dedicated 61-pin FPC connector for MIPI camera integration. For display, the board supports HDMI 2.0b, DP 1.2 and DP 1.4a via USB Type-C. Finally, it has two RJ-45 ports with 2.5GbE speed and dedicated drivers for Intel® Ethernet Controller I226-IT.

Both boards are available in extended temperature range models from -20°C to 70°C and support Microsoft Windows 11, Ubuntu 22.04 and Yocto 5.1.